The press-fit version of the connectors extends the use of MicroTCA architecture to thicker backplanes where the size and complexity of the backplane is not supported by standard surface-mount (SMT) reflow soldering processes. As backplanes become thicker and larger, proven press-fit technologies are often preferred, while applications with smaller and less complex backplanes allow for the more cost-effective application of SMT connectors.

The MicroTCA specification, developed within the PICMG organization, is said to create a physically small but powerful system in 4U height and 300 mm depth. The reduced size and cost are suitable for a wide range of applications such as core routers, IP-gateways, base stations, switching centers, and customer premises equipment. The system architecture reduces size and cost by eliminating the ATCA carrier board and providing a chassis that accepts AdvancedMC modules directly. MicroTCA shelves will also support hot-pluggable modules, which will increase availability by allowing individual modules to be serviced or upgraded without taking the shelf offline.
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